Scope:
The provision of materials analysis and failure analysis services, including SEM, TEM-EELS, EDS, FIB, SIMS, AFM, SRP, Alpha step, XRD, XPS, X-Ray, EMMI, EMMI-InGaAs, OBIRCH, C-AFM, Scanning Acoustic Tomography, Optical Microscope, Optical Profiler and IC Layout Imaging, Circuitry analysis, Auger, THEMOS mini, ESD/Latch-up, ESD Gun tests and Wire Bonding. The provision of reliability testing service, including High Temperature Operation Life test (HTOL), Bias Life test (BLT), Temperature Cycling test (TCT), Thermal Shock test (TST), High Temperature Storage test (HTST), Low Temperature Storage test (LTST), Pressure Cooker test (PCT/UB-HAST), Highly Accelerated Stress test (HAST), Temperature and Humidity Storage test (THST), Temperature and Humidity with Bias test (THB), Preconditioning test, Reflow test, Solderability test.
File Number: 20001845 ITL
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